PCB & Copper

Remove copper.
Define the track.

Application trials are ongoing for selective copper removal and track isolation on FR4 with 18 µm and 32 µm copper. Published examples will document the test pattern and the assessment of electrical and material quality.

Application trials ongoing
Concept schematic of selective copper removal · not a processed sample · not to scale
The current brief

Two copper thicknesses.
One process question.

SubstrateFR4
Copper thickness18 µm & 32 µm
ObjectiveSelective removal & track isolation
Current stageApplication trials ongoing

The substrate is part of the task.

Removing copper is only one part of a useful PCB process. A trial also needs to evaluate the remaining track edges, the exposed FR4 and the electrical separation between conductors.

Ultrashort pulses can limit surrounding thermal effects with a suitable process. Pulse overlap, repeated passes and material response still matter; a short pulse does not by itself establish a heat-free result.

Define a useful comparison.

  • Confirm the FR4 grade, board thickness, copper finish and complete layer stack.
  • Specify the track pattern, minimum isolation gap and dimensional tolerances.
  • Agree acceptable substrate damage, residue, redeposition and cleaning steps.
  • Choose the electrical isolation check and any cross-section inspection.
Trial evidence coming soon

A result you can assess.

Application trials are ongoing. Documented images and measurements will be added here; the record below shows what each published result will explain.

FR4 · selective copper removal

Results coming soon
Material & geometry

To record: sample identity, full layer stack, copper thickness, pattern dimensions and date.

Method & settings

To record: laser configuration, measured operating settings, optics, focus, scan strategy and passes.

Inspection & image scale

To record: inspection instruments, labelled scale bars, measurement method and electrical checks.

Quality & cycle time

To record: acceptance criteria, measured dimensions, substrate condition and what the reported time includes.

Limitations & next work

To record: unmet criteria, sample count, repeatability limits and any untested operating range.

Publication permission

To record: approval to publish the sample, images and data, plus attribution where applicable.

Coming soon: application notes and trial results

No microscopy images or trial data yet. The schematic above explains the objective and does not demonstrate processing performance.

Plan a relevant trial

Send the board stack.
Bring the acceptance criteria.

A drawing, representative material and a clear definition of a good result make the trial useful. Discuss the sample and shipping arrangements before sending boards.

Explore the source

Application trials are ongoing with PulseBrick, an ultrashort-pulse laser platform. The nominal configuration, unit-specific test report and application trial define the relevant operating conditions.

Meet PulseBrick

View technical specifications