FR4 · selective copper removal
To record: sample identity, full layer stack, copper thickness, pattern dimensions and date.
To record: laser configuration, measured operating settings, optics, focus, scan strategy and passes.
To record: inspection instruments, labelled scale bars, measurement method and electrical checks.
To record: acceptance criteria, measured dimensions, substrate condition and what the reported time includes.
To record: unmet criteria, sample count, repeatability limits and any untested operating range.
To record: approval to publish the sample, images and data, plus attribution where applicable.
No microscopy images or trial data yet. The schematic above explains the objective and does not demonstrate processing performance.
